01
Static characterization
High-voltage, high-current DC parameters with module, substrate and discrete-device interfaces.
DC · LEAKAGE · THRESHOLDCORE CAPABILITIES
Test certainty, built into every layer.
High-voltage and high-current test performance depends on the complete loop—not an instrument in isolation.
02
Dynamic characterization
Controlled switching, waveform capture and protection for two- and three-level topologies.
TURN ON/OFF · QRR · SC03
Reliability & thermal
Aging, stress and controlled-temperature routines with continuous monitoring.
AGING · −55 TO 200 °C04
Automation & data
Handling, recipe execution, BIN logic, AOI and factory integration for repeatable production.
FT · KGD · MES/EAPCOORDINATED ARCHITECTURE
The test loop is the product.
Source, device interface, load, protection, thermal control, data and automation are co-engineered to preserve signal integrity and safe operation.
01Excitation
02Low-Ls interface
03DUT
04Waveform capture
05Protection
06Result & BIN
APPLICATION ENGINEERING · SHENZHEN