IGBT modules
Static, dynamic, aging and automated FT for automotive and industrial module formats.
DEVICES & APPLICATIONS
Configured around the device. Ready for the line.
System architecture is selected from device technology, package, test objective, thermal condition and production stage.
Device coverage
Device coverage
SiC MOSFET
High-speed switching, short-circuit, wafer-level KGD and high-temperature evaluation.
Discrete devices
Diode, MOSFET, IGBT and SiC DC/AC test with automatic sorting.
DBC / AMB
Semi-finished substrate characterization before final module assembly.
IPM / PIM
Integrated module characterization and configurable production screening.
Wafer & die
CP, AC/DC test, AOI and known-good-die handling before packaging.
Application domains
Application domains
xEV & charging
Traction inverter, OBC and charging power-module validation.
Industrial control
Inverter, servo and high-reliability power conversion.
Renewable energy
Photovoltaic, energy storage and power conversion systems.
Consumer & power
High-volume power-device screening and module final test.
APPLICATION ENGINEERING · SHENZHEN